Research Support Specialist, IEEC
Office: BI- 1413
Debbie Dittrich is a Research Support Specialist who is primarily responsible for teardown analysis of electronic assemblies. She is also involved in failure analysis of circuit package manufacturing problems. Her area of expertise is cross sectioning, but she is also proficient in x-ray imaging and SEM\EDS imaging and analysis. Students who want to use lab equipment for various projects enlist her assistance. Debbie joined the IEEC in 2002. She was previously employed by IBM Endicott Microelectronics Division and IBM Owego Circuit Packaging Division for a total of 17 years. Her most recent assignment was in the Failure/Materials Analysis Lab in Endicott, where she provided analysis using the Auger Electron Microscope and the FTIR Microscope. She received a BA in Environmental Studies from SUNY Binghamton.