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Ron Kuracina

Ron Kuracina

Company Interface Specialist, IEEC
Office: COE-1111
Phone: (607) 777-4334
Email: kuracina@binghamton.edu

 

Ron Kuracina’s primary role at the IEEC it to work with local electronics companies to provide analytical services and directions to help customers manage their electronic packaging problems, issues and concerns. Ron is involved in the education of area companies as to the capabilities and services available through the IEEC, as well other as other SUNY Binghamton technical support organizations. Ron joined the IEEC after nearly 24 years with the IBM Microelectronics – Corporation in Endicott, New York, where he held a variety of business and engineering positions focused on semiconductor packaging, printed wire boards and electronic assemblies. Ron’s most recent work experience was as an applications engineer with Endicott Interconnect Technologies supporting leading edge semiconductor packaging for various companies throughout the United States. His technical experience includes assignments as a manufacturing, reliability, new products and application engineer. Ron’s business experiences involve a number of positions involving finance, manufacturing competitiveness, strategic and tactical product marketing and business development. Ron received his BS engineering degree from the SUNY College of Environmental Science & Forestry, and a BS Science degree from Syracuse University.

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 2/8/17