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The 2 day program will include Keynote Lectures, Technical Presentations, a Half-day 2.5/3D Workshop, and a Student Poster Session on topics including:       

Thermal Challenges

MEMS & Photonics

3D Packaging

Flexible Electronics

Additive Manufacturing

Power Electronics

Sensors & Embedded Electronics

Harsh Environments 

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 11/8/16