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Summary of 2011 Electronics Packaging Symposium 



The Integrated Electronics Engineering Center a New York State Center of Advanced Technology at Binghamton University, part of The New York State Center of Excellence in Small Scale Systems Integration and Packaging, in conjunction with GE Global Research Center and the Binghamton Chapter of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) hosted the 2011 Electronics Packaging Symposium, Technology Advances in Small Scale Systems and Microelectronics Packaging, October 10-11, 2011 at Binghamton University.

The symposium provided over 150 attendees from academia, government and industry with information about promising new technologies and developments that are now impacting the electronics industry. Participants received overviews and research reports on a range of emerging technologies including: National Trends, Thermal Management, 3-D Packaging, Sensors/MEMs, Power Electronics, Packaging for Harsh Environments, Interconnects, Miniaturization, and Flexible/Printed Electronics.

The symposium was opened by Bahgat Sammakia, Interim Vice President for Research, and Jerry Trant, GE Global Technology Leader, Micro & Nano Structure Technologies. Speakers included:

Tien Wu, Chief Operating Officer, ASE  Rob O'Reilly, Analog Devices
Terry Ericsen, Office of Naval Research  S. Manian Ramkumar, RIT
Klaus Hummler, SEMATECH  Liangyu Chen, NASA
Brandon Prior, Prismark Partners  Roger Quon, SEMATECH
Madhu Iyenagar, IBM  Tan Zhang, GE Global Research Center
Yifan Guo, Skyworks Solutions, Inc.  Lei Fu, AMD
Emad Samadiani, Binghamton University  Gamal Refai-Ahmed, PreQual Tech Corp.
Bernd Appelt, ASE Group  Wayne Jones, Binghamton University
Shakti Chauhan, GE Global Research  Joseph Fjelstad, Verdant Electronics
Michael Gaynes, IBM TJ Watson Research Center  Romeo Delrosario, Army Research Laboratory
Carl Raleigh, Analog Devices  Liang Yin, Universal Instruments
Sang Won Yoon, Toyota Research Institute of NA  Kock-Yee Law, Xerox
Ralf Lenigk, GE Global Research  Yongjae Lee, GE Global Research
Jared Hornberger, APEI  Mark Poliks, Endicott Interconnect Technologies
Andrew Oliver, WIMS, University at Michigan  Brian Roggeman, Universal Instruments
Patrick McCluskey, University of Maryland  


Dinner remarks were given by Steve Betza Corporate Director, Electronics Engineering and Packaging, Lockheed Martin.

The next symposium is scheduled for Fall, 2012 at GE Global Research, Niskayuna, NY.

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 4/12/16