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2014 Electronics Packaging Symposium 

OCTOBER 8-9, 2014

The Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology at Binghamton University, part of The New York State S3IP Center of Excellence, in conjunction with GE Global Research Center and the Binghamton Chapter of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) hosted the 2016 Electronics Packaging Symposium & Workshop October 8-9 at Binghamton University's Center of Excellence. This is a particularly exciting year, as this marks the grand opening of the Center of Excellence. 

The symposium provided over 200 attendees from academia, government and industry with information about promising new technologies and developments that are impacting the electronics industry. Participants received research reports on a range of emerging technologies including: 3D Packaging, Mobile Electronics, Sensors/MEMS, Thermal Challenges, Embedded Electronics, Printed Electronics/Additive Manufacturing, Flexible Electronics, and High Temperature Electronics. 

The symposium was opened by Bahgat Sammakia, VP for Research, Binghamton University and Jerry Trant, Technology Leader, GE Global Research. Following opening remarks, keynote presentations were provided by Bill Bottoms (3MTS), Ning-Cheng Lee (Indium Corporation), Shiuh-Kao Chiang (Prismark), and Subramanian Iyer (IBM). Session speakers included:

Ken Araujo, NAMICS
Jerome Azemar, Yole
John "Dan" Berrigan, Air Force Research Laboratory
James Castracane, CNSE
Richard Chaney, American Semiconductor
Frank Egitto, i3 Electronics
Mike Ellsworth, IBM
Amy Fleischer, Villanova
Sean Garner, Corning
Charan Gurumurthy, Intel
Alan Huffman, RTI
Satish Kandlikar, RIT
Kangwook Lee, Tohuku University
Tao Li, University of Michigan
Weiping Liu, Indium
Eric MacDonald, University of Texas
Amy Marconnet, Purdue University
Patrick McCluskey, Univesity of Maryland
Hiroyuki Okabe, Shindo Electronics
Bob Patti, Tezzaron
Mark Poliks, Binghamton University
Bill Polinsky, MS Kennedy
Neil Poole, Henkel
Steve Ready, PARC
Harry Schoeller, Universal Instruments
Dave Shaddock, GE Global Research
Aric Shorey, Corning
David Smukowski, Sensors in Motion
Chris Spadaccini, Lawrence Livermore National Lab
Christopher Williams, Virginia Tech
Chuck Woychik, Invenses
Tomoyuki Yamada, Kyocera


The keynote dinner presentation was provided by Alan Rae from Alfred Technologies Resources. 


The next symposium will be held at GE Global Research, September 15-16, 2016. 

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 11/21/16