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2015 Electronics Packaging Symposium

September 15-16, 2015

 

The Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology at Binghamton University, part of The New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP), in conjunction with GE Global Research Center and the Binghamton Chapter of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) hosted the 2015 Electronics Packaging Symposium, Technology Advances in Small Scale Systems and Microelectronics Packaging,September 15-16 at GE Global Research in Niskayuna, New York.

The symposium provided over 200 attendees from academia, government and industry with information about promising new technologies and developments that are impacting the electronics industry. Participants received research reports on a range of emerging technologies including: 3D Packaging,Additive Electronics, Energy Conversion and Storage, Sensors/MEMS,Flexible and Printed Electronics, Thermal Challenges, Emerging Materials, Embedded Electronics and Harsh Environments.

The symposium was opened by Daryl Santos, Director of the Integrated Electronics Engineering Center (IEEC), and was followed by keynote speakers Jennifer Lewis, Ljubisa Stevanovic, Lesley Polka and Stan Whittingham. Session speakers included:

Meriem Akin, IMPT Leibniz Universitaet Hannover
Ken Aroujo, Namics
Mark Bachman, UCI
Sushil Bhavnani, Auburn University
David Borton, Brown University
Bill Bottoms, 3MTS
Chris Bower, XL Print     
Liangyu Chen, NASA
Sihai Chen, Indium
Ken Church, nScrypt
Denis Cromier, RIT
David Danovitch, U. of Sherbrooke
John Dzarnoski, Starkey
Michael Fancher, CNSE
Luc Frechette, University de Sherbrooke
Dan Goia, Clarkson University
Samuel Graham, Georgia Tech
Ibrahim Guven, VCU
John Hunt, ASE
Ilia Ivanov, ORNL
Erik Jung, Fraunhofer
Ray Karam, Invenios
Beth Keser, Qualcomm
John Knickerbocker, IBM
Aaron Knobloch, GE
Michael Lier, CNSE
James Lu, RPI
Gary Mandrusiak, GE
Shalabh Maroo, Syracuse University
Patrick McCluskey, UMCP
Jeff Morse, University of Massachusetts
Shelby Nelson, Kodak
Chukwudi Okoro, NIST
Mark Olde Riekerink, Micronit
Kyong Paik, KAIST
Mike Renn, Optomec
Harry Schoeller, UIC
Alex Waldauer, Anaren
Brandon Wang, Cadence
Evelyn Wang, MIT
 

 

Mark Christensen provided the lunch presentation on "Internet of Things." The dinner presentation was given by Dean Hari Srihari on the "Future of Healthcare Systems".

The next symposium is scheduled for October 2016 in Binghamton, New York. 

 

 

*Presentations are password protected and may only be viewed by conference attendees and IEEC member companies. Some presentations may not be available, per the presenter and/or their company policy. Questions? Contact Katelynn Hrywnak

Binghamton University State University of New York
PO BOX 6000   Binghamton, NY 13902-6000

Last Updated: 11/17/16