Distinguished Professor and Director of the Small Scale Systems Integration and Packaging (S3IP) Center
PhD State University of New York, Buffalo
Phone: (607) 777-6880
FAX: (607) 777-4683
Teaching/Research Focus: Heat Transfer, Electronics Packaging.
Bahgat Sammakia was employed by IBM Endicott from 1984 until 1998, and held various management positions, including managing the thermal and mechanical analysis groups, the surface science group, the chemical lab, the site technical assurance group and his last position as manager of development for organic packaging in the IBM Microelectronics Division. Sammakia holds seven U.S. patents and 12 IBM technical disclosures; he has published over 50 technical papers in refereed journals and conference proceedings and has contributed to three books on natural convection heat transfer and electronics packaging.