The Scanning Acoustic Microscope commonly known as C-SAM, provides imaging of interior layers of a device and is used in detecting defects such as delaminations, adhesion artifacts, voids, bubbles, holes, cracks, particles, inclusions, etc. C-SAM is an important tool for non-destructive failure analysis (back end, front end), reliability testing of components, process and production control, vendor qualification and quality control and R&D. C-SAM technique is used for non-destructive testing of plastic encapsulated IC packages, grid ball arrays, flip-chip packages, bonded wafers, printed circuit boards, capacitors and resistors, ceramics/metals/ glasses/plastic components and compounds, power, hybrid devices, medical devices, structures and material characterization.
ADL owns an Evolution II C-SAM system from PVA TePla. Its main capabilities are:
- Pulse-echo and through scan imaging modes
- Low, medium and high frequency transducers: 15MHz, 50MHz, 100MHz, 230MHz and 300MHz acoustic lens
- Lateral resolution down to 5 μm depending on transducer, sample material and thickness
- Maximum scan area of 30 cm x 30 cm
- All standard pulse echo modes such as C, B, A, diagonal, G, X, tray scans
Instrument Manager: Anju Sharma
