William Butler received his bachelors of science in mechanical
engineering from Clarkson University and a master’s degree in mechanical engineering
from Binghamton University, where he studied shock and vibration of populated
printed circuit boards. In 2007, he joined the Analytical and Diagnostics
Laboratory, where he works with sample preparation tools such as grinding and
polishing, thermal tools including Thermo Gravimetric Analyzer (TGA), Differential
Scanning Calorimetry (DSC), Thermo Mechanical Analyzer (TMA), flash diffusivity
and Dynamic Mechanical Analyzer (DMA), optical microscope and optical
profilometry. He also provides IT support to keep the computers running and
manages the FOM system.
William Butler
Research Engineer
S3IP – Small Scale Systems Integration and Packaging
Background
