2019 Electronics Packaging Symposium

  Don't miss your chance to be a part of the premier Packaging Symposium in the Northeast!

The 31st Annual Electronics Packaging Symposium

Date: September 5-6, 2019

Venue:  GE Global Research Center in Niskayuna, New York


The 31st Annual Electronics Packaging Symposium and Workshop will take place at our partner company, GE, this year.

Take the opportunity to market products and services to over 250 decision makers and leaders of the electronics packaging industry.

Display your products, knowledge and services to a concentrated, target audience. Meet new decision makers and qualified leads, reconnect with existing customers, and close on business, all in one day.


Our team is currently in preparation mode for this upcoming event. Kindly check back at a later date for more info and details on the registration process. 


In the meantime, check out last year's 2018 Symposium, our largest one to-date:




2018 Session topics:

  • 2.5/3D Packaging
  • 5G Needs in Packaging
  • Automotive & Harsh Environments
  • Bioelectronics
  • Flexible & Additive Electronics
  • Materials for Packaging & Energy Storage
  • MEMS
  • Photonics
  • Power Electronics
  • Sensors, Embedded Electronics & IoT
  • Thermal Challenges
  • Wearable and Flexible Electronics for Medical Applications


 2018 Keynote speakers




IBM Corp.                               

Title: Advancing Integration for High-End System Packaging

In this presentation, the challenges and opportunities of highly-integrated packaging for high-end systems will be discussed. At critical times in the history of computing, the creative use of packaging has provided significant steps forward in system capability by enabling and delivering integration and density of components. We are at such a point now and there is much interest in topics such as heterogeneous integration, panel or wafer-level fan-out and 3D stacking. Leveraging these technologies in high-end systems creates a special challenge with the relatively large number of circuits, large volumetric scale, and relatively low number of components built in comparison to other industries.
About: Dale Becker received the B.E.E degree from the U. of MN, M.S.E.E. from Syracuse U. and the Ph.D. from UIUC. He is a Chief Engineer of Electronic Packaging Integration in IBM Systems. His responsibility is the electrical system packaging architecture of IBM Systems including the design of high-speed channels to enable the computer system performance and the power distribution networks for reliable operation of the integrated circuits that make up the processor subsystem.

Dr. Becker currently chairs the IEEE EPS TC-EDMS and is a Senior Area Editor for the Transactions on CPMT. He has chaired the iNEMI PEG on High-End Systems including the chapter on the High-End Systems Roadmap. He is an IEEE Fellow.




NXP Semiconductors             

Title: Packaging and the Autonomous Car

As the automotive industry progresses towards self-driving cars, the business opportunities and challenges are becoming increasingly clear. In addition, autonomous system architectural and component decisions are also becoming clear. They include sensing requirements, workload partitioning between centralized and distributed computing nodes, security, and communications. These systems drive great diversity in the types and capabilities of the microelectronic packaging required to support them, which will also be detailed.
About: Glenn G. Daves is Vice President of Package Innovation at NXP Semiconductors. He is responsible for package design, package technology development, and assembly process development in support of NXP's full product portfolio. Prior to its acquisition by NXP, Glenn led packaging and printed circuit board development for Freescale Semiconductor. Prior to that, he led global packaging product and technology development at the IBM Corporation. He has also held leadership positions in project management, test and burn-in engineering, and assembly manufacturing engineering. Glenn holds twenty-seven U.S. patents and has degrees from Brown University, the University of Illinois at Urbana-Champaign, and Alliance Theological Seminary. He serves on the board of trustees of Nyack College and on the National Leadership Council of World Vision U.S.





Title: Packaging Solutions for ASIC Performance Optimization

Delivering today's complex electrical functions to the marketplace depends on the electronic package. Modern day Application Specific Integrated Circuits (ASICs) use complex organic and inorganic building blocks to protect the device from its environment, while providing sufficient power for a plethora of gates. This presentation will cover technical challenges and solutions to support manufacturing of these complex ASIC products. This includes the shift from standard 2D flipchip packages towards more complex solutions that include ultra-large body, MCM, and 2.5D/3D packaging. These packages can combine the ASIC with passives, memory, or other devices while maintaining robust junction temperatures. Packages built with these features solve simultaneous challenges while delivering the sought after electrical functions.
About: Steve MacQuarrie is a Senior Member of the Technical Staff in GLOBALFOUNDRIES' Technology & Development organization. For twenty years, he's applied inorganic and organic packaging technologies to ASICs. Recently, his team introduced a multichip module, with a 14 nm ASIC die, into package assembly manufacturing. In addition, he was part of the development team for the industry's first commercial CMOS manufacturing technology to employ through-silicon-via (TSV) wafers. Steve is a certified Project Management Professional and holds a master's degree from Virginia Tech.


Malcolm Thompson



Title: What's Next in System Integration?

This presentation will describe the game changing system integration approaches of Flexible Hybrid Electronics (FHE) and associated manufacturing techniques that are in development at NextFlex and within our community. FHE manufacturing combines new materials, components, and processes to produce electronics with previously impossible form factors – systems that can bend, flex, and twist and take advantage of materials that were historically not possible to integrate into electronics by using low temperature integration – blurring the lines between packaging, PCB, and system assembly. A new era of digital process flow, mass customization, and speed to market will enable previously unimagined applications that take electronics and our thinking...'out of the box'.
About: Dr. Thompson brings over 30 years of executive experience in the display, semiconductor and telecom industries to his current role as Executive Director of NextFlex. He served as the Founder and Chairman of the US Display Consortium and was CTO at Xerox PARC. Dr. Thompson was also CEO of four startups during his career, raising over $300M: dpiX, makers of digital x-ray imaging systems; Novalux, providers of high power vertical cavity lasers; Vitex, makers of encapsulants for OLEDs, and RPC, manufacturers of touch systems for mobile products. He has served on the Board of Directors of 5 Public Companies and 7 Private Companies. He has over 100 patents and publications. Recent advisory roles include advisor to the National Academy of Sciences for flexible electronics, and to the Pentagon and White House Economic Advisory Council; and was appointed Technology Pioneer at the World Economic Forum in 2000 and in 2001. Dr. Thompson received a Ph.D. in Applied Physics from the University of Brighton.


 Take the opportunity to showcase who you are:


 Be a sponsor


  • 3 full complimentary registrations
  • 1 6-foot table (2 days of exhibit time)
  • 1 full-page color ad in program
  • Company logo and name on website and conference signage


 Be an Exhibitor


  • 1 full complimentary registration
  • 1 6-foot table (2 days of exhibit time)
  • Company name listed in program and on website


Details to come. We hope to meet you in the Fall!



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