Research
Current CHIRP research projects include:
- Conformal Polymeric Thin Films Manufacturing Using Electrospray Printing, led by Paul Chiarot
- Fine Pitch Cu-Sn Based Interconnection Below Temperatures of 180oC, led by Nikolay Dimitrov
- Reliable Low Temperature Solder Approach, led by Peter Borgesen
- Design, Fabrication, and Testing of Metal Porous Media for Thermal Capacitor and Immersion Cooling Applications, led by Bahgat Sammakia
