BINGHAMTON, NY -- Binghamton University’s Integrated Electronics Engineering Center (IEEC), a New York State Center for Advanced Technology in electronics packaging, in conjunction with GE Global Research and the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, will host the annual Electronics Packaging Symposium on Oct. 15 and 16, in the Engineering and Science Building at the Innovative Technologies Complex on Murray Hill Road.

The symposium will bring together leading researchers from academia, national labs and industry to focus on electronics packaging, a field that encompasses all components of computers, cell phones and other electronic devices, except for the integrated circuit or chip. Topics of discussion will include packaging trends, medical electronics, thermal challenges, 3-D packaging, sensors, packaging for high temperature and power applications, miniaturization, and flexible/printed electronics.

The symposium will include a student poster session, a networking reception and a dinner speaker.   A new 2.5D / 3D Packaging Workshop which is sponsored by the IEEC and IEEE CPMT will be held after the symposium on the afternoon of Oct. 16. This workshop is organized for a critical look at the ecosystem for a 2.5D and 3D packaging roadmap to enable and support pervasive electronic system integration.

For information on cost of attendance and registration details, visit http://www2.binghamton.edu/ieec/symposium2013/index.html

For additional information, contact Bill Infantolino, associate director of the IEEC, at binfanto@binghamton.edu or 607-777-4349.