Marilyn Angelo
Assistant Director for Administration
S3IP – Small Scale Systems Integration and Packaging
Benson Chan
Associate Director, S3IP
S3IP – Small Scale Systems Integration and Packaging; Research, Office of the Vice President for
Tara Dhakal
Associate Professor; Director
Electrical and Computer Engineering; Center for Autonomous Solar Power (CASP)
Lucille (Lucy) Friend
Administrative Assistant; Administrative Assistant, ES2
Center for Energy- Smart Electronic Systems (ES2); S3IP – Small Scale Systems Integration and Packaging
Kanad Ghose
Distinguished Professor, Center Director
School of Computing
Theresa Hollister-Ball
Associate Director for Program Administration and Operations, CAMM
S3IP – Small Scale Systems Integration and Packaging
Maria Miller
Finance Assistant
S3IP – Small Scale Systems Integration and Packaging
Andrea Palmeri
Research Development Specialist; Managing Director of ES2
Office of Strategic Research Initiatives; S3IP – Small Scale Systems Integration and Packaging; Center for Energy- Smart Electronic Systems (ES2)
S.B. Park
Director of IEEC; Director of IEEC; SUNY Distinguished Professor
Integrated Electronics Engineering Center (IEEC); Mechanical Engineering
Caroline Pasquale
Project Staff Associate
S3IP – Small Scale Systems Integration and Packaging
Mark D. Poliks
SUNY Distinguished Professor; Undergraduate Director; Director, CAMM
School of Systems Science and Industrial Engineering; S3IP – Small Scale Systems Integration and Packaging
Bahgat G. Sammakia
Director of CHIRP at Binghamton University; Distinguished Professor; Vice President for Research; Dir of CHIRP at Binghamton Univ; Center Director of ES2; Director, S3IP; Center Director of ES2; Vice President for Research; Director, S3IP
Center for Heterogeneous Integration Research in Packaging (CHIRP); Mechanical Engineering; Center for Energy- Smart Electronic Systems (ES2); Research, Office of the Vice President for; S3IP – Small Scale Systems Integration and Packaging
Ayushman Singh
Research Scientist
S3IP – Small Scale Systems Integration and Packaging
