Our Spring TAB Meeting was held on Wednesday February 26. At this meeting, our industry
members presented their project needs for this year's cycle of pooled projects.
We invite BU faculty members to submit a proposal and also encourage reaching out
to our TAB members to assist you in the development of your proposal.
Extended Proposal Deadline: May 4, 2020 (by 5 p.m. to ieec@binghamton.edu)
For access to proposal guidelines and industry presentations, contact ieec@binghamton.edu.
Lunch and Learn
We would like to invite all BU faculty from the Department of Physics, Chemistry,
and Watson to join us for our "Lunch and Learn" meeting on Monday, February 24, from 11:30 a.m.–1:30 p.m. in the Multipurpose Room (COE 2011) at the Center of Excellence.
Join us to learn about our center and the opportunities we can assist you with.
BU Day at the Oakdale Mall
Arad Azizi, BU PhD Candidate in Mechanical Engineering, and student team,
On February 22, 2020, Binghamton University hosted it's Annual Day at the Oakdale Mall in Johnson City. The IEEC and students from the Mechanical Engineering
Department demonstrated the use of a 3D Printer and the possibilities of what could
be created with such equipment. Parents and children who stopped by were able to take
home fun 3D printed trinkets.
This event opens the door for the community to have a glimpse of the kinds of research
and programs taking place at BU, as well as inspire children through exposure to different
disciplines that they could potentially pursue in the future.
ECTC Committee Meet in Dallas to Review Abstracts for 2020 Conference
Associate Director of IEEC and Chair of ECTC Emerging Technologies Session, Benson
Chan (most left), with his committee members.
The Electronic Components and Technology Conference (ECTC) Program Committee, made
up of professors and instructors for academia and industry, convened in Dallas, Texas
on November 7-8, 2019 to review well over 500 abstracts for the 2020 conference taking
place on May 26-29, 2020 at Walt Disney World Swan and Dolphin Resort in Lake Buena
Vista, Florida.
IEEC Director, SB Park, and Associate Director, Benson Chan, made their way to Dallas
to participate in the two-day review process as they are active members of the ECTC
Committee: Park is Chair of the Applied Reliabilty Committee, while Chan is Chair
of the Emerging Technologies Committee.
Director Mark Poliks of our sister center, Center for Advanced Microelectronics Manufacturing
(CAMM), is also an actively involved member who previously served as Vice General
Chair of the ECTC Executive Committee.
These papers will be presented by members from companies, universities and research
institutions, covering a wide range of topics which include advanced packaging, modeling
and simulation, Photonics, interconnections, materials and processing, applied reliability,
assembly and manufacturing technology, components and RF, and emerging technologies.
SB Park receiving the Clock Award at the 2019 ASME InterPACK Conference
Director SB Park of the IEEC was presented with the 2019 Clock Award at ASME's 2019
InterPACK Conference (International Technical Conference and Exhibition on Packaging
and Integration of Electronic and Photonic Microsystems) that took place October 7-9
in Anaheim, CA. This award was presented by the K16 Committee on Heat Transfer of Electronics and
the Electronic and Photonic Packaging Division for Park's outstanding accomplishments
and service to the field of Electronics and Photonics Packaging.
Congratulations Director Park for your dedication and service to the field.
Benson Chan Receives iMAPS Outstanding Educator Award
Benson Chan is recognized as an outstanding educator at the 2019 iMAPS conference
Associate Director, Benson Chan, of the IEEC, was presented with the Outstanding Educator
Award at iMAPs 52nd International Symposium on Microelectronics, which took place
September 30-October 3, 2019, in Boston, MA.
This award is presented to an individual who has provided significant contributions
to education, within or outside the realms of academia, for the electronics packaging
industry and/or to the advancement of IMAPS Student Chapters.
Chan giving a lecture for an engineering course at BU
iMaps is the largest society dedicated to the advancement and growth of microelectronics
and electronics packaging technologies through professional education.
Benson Chan is the president of the Empire Chapter of iMAPS and is active in organizing
local workshops and meetings to connect members in upstate NY with topics pertinent
to the evolving field.
Congratulations to Benson Chan for his active role and continued dedication in sharing
knowledge with a community of students, faculty and members of organizations and industry.
2019 Electronics Packaging Symposium Poster Session Winners Recognized for their Excellence
in Research
Professor Manuel Smeu (faculty advisor for first place), Michael Woodcox (first place
winner) Dean Krishnaswami "Hari" Srihari (Dean of Thomas J. Watson School of Engineering
and Applied Science), Professor S.B. Park (faculty advisor for second place), VanLai
Pham (second place research team member), Mohammed Alhendi (third place research team
member) and Professor Peter Borgesen (faculty advisor for third place).
Congratulations to the student poster session winners who presented at the 31st Annual
Electronics Packaging Symposium at Niskayuna, NY. 37 Students participated in the
poster session and were able to meet and share their research with attendees from
across disciplines in industry, academia and government.
First Place: Michael Woodcox and his research team
Second Place: Jiefeng Xu and his research team
Third Place: Arun Raj and his research team.
You may find out more about the winners in this article released in the Binghamton University News website.
Student and Faculty Recognized for Excellence in Research in the SEMLab
From left to right: Hongya Lu, Prof. Sang Won Yoon, Irandokht Parviziomran, Prof.
Daehan Won, Jae Lee, Director S.B. Park, Jong Ha, Ke Pan, Associate Director Benson
Chan, Nourma Khader.
In celebration of the achievements made in our SEMLab, in partnership with Koh Young
Techonology, a luncheon and a time of recognition took place on July 30. Seven faculty
members and graduate students were recognized for their research contributions to
the development of the lab.
A special congratulations to the four student recipients of the IEEC Award for Excellence
in Research: Hongya Lu, Irandokht Parviziomran, Jong Ha, and Ke Pan!
A visit from Tioga Hills Elementary School
Yet again, another fun-filled day with our young friends from Tioga Hills Elementary
School. On Monday, April 29, Research Scientists Dr. Jung, Dr. Sharma, and Dr. Proper,
from the Analytical and Diagnostic Laboratory (ADL), met with fourth-graders to give
a tour of the lab. The students were able to learn about scientist works and the kinds
of equipment used, along with experimenting with liquid nitrogen in a safe yet fun
environment.
A visit from Vestal Hills Elementary School
On Friday, March 29, the Analytical and Diagnostic Laboratory (ADL), a fellow member
of our family of research centers, provided a lab tour for our special visitors from
Vestal Hills Elementary School.
The tour provided an opportunity for fourth grade students to see firsthand the works
of a scientist and the equipment they use.
Scientist Jenny Proper, showed what it would be like to see specimens and pollen samples
in high resolution under an electron microscope, while Senior Scientist Anju Sharma,
engaged the students in interactive experiments with liquid nitrogen, by freezing
flowers and cheese puffs, to highlight its properties and portray the effects, in
a fun manner.
The lab tour allowed for students to walk away with an educational experience beyond
the classroom, taking away with them the values and possibilities offered in the field
of science.
IEEC to receive Outstanding Research Award, presented by Koh Young Technology, Inc.
Working together for nearly 3 years in SEML, Koh Young Technology Inc. has been a
part of providing invaluable technical support with the smart factory, and together,
our research has advanced in fine-tuning SMT to feature accuracy, reliability and
process optimization.
Thank you Koh Young Technology Inc., for this recognition and your valued partnership.
2019 Binghamton University Industry Day
We would like to place a special thanks to ASE for graciously hosting our successful
"Binghamton University Industry Day."
This event took place in San Jose, California, where our IEEC Director, SB Park and
Associate director, Benson Chan, together with the S3IP team, provided companies on
the west coast an opportunity to learn about the uniqueness of our centers and labs.
Topics of interest were:
• Thermal management, failure analysis, reliability improvement, material properties
and mechanics for electronics manufacturing, including heterogeneous integration
• Advances in Industry 4.0 automation for electronics manufacturing lines
• Progress in commercialization of flexible hybrid electronics
• Techniques for data center energy efficiency improvement
• Warpage Engineering and stress reduction for improved assembly and reliability
More information on this event to come.
Technical Advisory Board Meeting Held at the COE
Thank you to our Technical Advisory Board, faculty and staff members for attending
our Technical Advisory Board Meeting held on March 12, 2019.
At this meeting, industry members shared their project needs, while faculty members
shared their research topics. This opened the floor for potential collaboration on
Pooled Research Projects for the year 2019-2020.
Faculty members are encouraged to submit proposals for an opportunity to be "seed"
funded by the IEEC.
Deadline for submission of research proposals: April 30, 2019
Awarding of the 2019-2020 Pooled Research Projects: May 15, 2019
Please take a look at our guidelines.
Proposals may be submitted to IEEC@binghamton.edu.
You may also contact the above address with questions or requests for more information
regarding our TAB member presentations.
SB Park To Receive Excellence in Mechanics Award
On August 30, 2018, Professor SB Park from the Mechanical Engineering Department,
is to receive the Excellence in Mechanics Award, presented by the American Society
of Mechanical Engineers' Electronics and Photonic Packaging Division.
This award is in recognition of outstanding achievement in engineering, presented
only once to an individual who has demonstrated excellence in the engineering and
science of structural mechanics of electronic systems. However, if you ask Park, he
will humbly say, "I did not do much other than performing as usual."
Park is the director of the Integrated Electronics Engineering Center (IEEC) and the
Optomechanics and Physical Reliability Laboratory at Binghamton University.
He began his academic career at Binghamton University in 2002, and his expertise in
micro/nano mechanics and optomechanics contributes to the center in conducting on-going
and prospective projects.
Park first began his professional career at IBM Microelectronics Division where he
conducted numerous analyses to put products out on time. Later, he was engaged in
the reliability engineering responsible for the reliability of flip-chip technology
and high-performance packaging.
Park will receive this award at the 2018 International Technical Conference and Exhibition
on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) in
San Francisco.
IEEC held its Technical Advisory Board (TAB) at Binghamton University's Center of
Excellence.
The Integrated Electronics Engineering Center (IEEC) held its Technical Advisory Board
(TAB) Meeting on June 12, 2018 at Binghamton University's Center of Excellence. Associate
Director, Benson Chan, announced the 2018-2019 Pooled Research Projects.
This year, six projects will receive a funding of $50,000 and and additional three
projects will receive a "seed" funding of $25,000. A total of nineteen projects were
submitted.
The 2018-2019 projects are as below:
Beyond Silicone Elastomer - Ahyeon Koh
Computational Study on the Mechanical Properties of Bi alloys for Pb-free Solder -
Manuel Smeu
Micron-level Thermal and Mechanical Characterization of Thermal Interface Materials
to Understand Material Variability to Prevent Hot-Spot - Scott Schiffres
Properties and Use of Fused Nano-Particles – Peter Borgesen
Smart Chip Mounting Process Control in PCB Assembly Process via Artificial Intelligence
- Daehan Won and Sang Won Yoon
Toward Green and Biodegradable Electronics: Paper-based Printed Circuit Boards - Seokheun
Choi
The Behavior of PbFree Solder Joints Containing Bi: High Melt -Low Melt Solder Interconnect
Structures for SMT Applications - Eric Cotts and Nikolay Dimitrov
DasPritramThree Phase High Power Density Wide Band Gap (WBG) Devices and Commercial
off the Shelf (COTS) Components Based AC to DC Power Converters for More Electric
Aircraft System -
Tomographic Characterization of Waveguides Fabricated by Laser Direct Writing – Bonggu
Shim
For additional information, or to partner with us, please contact Benson Chan (chanb@binghamton.edu)
Binghamton University Day at ASE
SB Park, Director of the IEEC, and Benson Chan, Associate Director, traveled with
the S3IP Team to San Jose, CA to meet with over 20 companies during S3IP Industry
Day, June 18-19. Presentation topics included:
Thermal management, failure analysis, reliability improvement, material properties
and mechanics for electronics manufacturing, including heterogeneous integration
Advances in Industry 4.0 automation for electronics manufacturing lines
Progress in the commercialization of flexible hybrid electronics
Contact us for more information.
Debbie Dittrich shares her experience working at IEEC
Debbie Dittrich is a Research Support Specialist who has been a staff member at the
IEEC for fifteen years. Dittrich specializes in teardown analysis of electronics for
various companies, failure analysis of circuit package manufacturing problems, and
provides cross-sections, digital images and measurements of components in the products
she receives.
Her skills and line of work are an impressive list which extends to work related with
x-ray and SEM.
Prior to joining the IEEC, Dittrich was a member of the IBM Endicott Microelectronics
Division and IBM Owego Circuit Packaging Division for seventeen years. Her most recent
work has been evaluating the iPhone X and the Samsung Galaxy S9 (courtesy of Prismark
Partners) using x-ray imaging and cross-sectioning techniques.
The measurements she takes can vary depending on the product and the elements of interest
in the electronic device. Once the sample has been grounded to the appropriate plane,
it must be highly polished to ensure the clearest surface for measurements. A Nikon
camera is used to take images of the cross-section which are then analyzed for measurements.
This requires a high degree of attention to detail. Debbie has also done work with
watches, other Apple products, and speakers from phones.
Please contact Debbie at dittrich@binghamton.edu if you would like to know more about her work.
IEEC presented 9 research papers at ECTC in San Diego, California
The Integrated Electronics Engineering Center (IEEC) took part at ECTC in San Diego,
California, on May 28. The IEEC introduced nine papers/presentations at ECTC, which
included:
Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal
Cycling and Power Cycling Shuai Shao, Yuling Niu, Jing Wang, Ruiyang Liu, and Seungbae
Park – Binghamton University; Hohyung Lee, Gamal Refai-Ahmed, Laurene Yip – Xilinx,
Inc.
Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
Jisun Hong and Kyongsei Cho – Samsung Electronics Company, Ltd.; Seungbae Park, Shuai
Shao, Yuling Niu, Huayan Wang, and Van Lai Pham – Binghamton University
Effects of the Interlayer Thickness and Alloying on the Reliability of Transient Liquid
Phase (TLP) Bonding Junghyun Cho and Fei Dong – Binghamton University; Liang Yin and
David Shaddock – GE Global Research
Effects of Laser Selective Reflow on Solder Joint Microstructure and Reliability Luke
Wentlent – Universal Instruments Corp.; Mohammed Genanu, Thaer Alghoul, and Peter
Borgesen – Binghamton University; Jim Wilcox – Universal Instruments Corp; Francis
Mutuku – Indium Corporation
Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using
the Digital Image Correlation (DIC) Method Van Lai Pham, Yuling Niu, Jing Wang, Huayang
Wang, Shuai Shao, Charandeep Singh and Seungbae Park – Binghamton University; Cheng
Zhong, Sau Wee Koh and Jifan Wang – Huawei Technology Co., Ltd.
Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics
Based Medical Monitor Thaer Alghoul, Manu Yadav, Sanoop Thekkut, Rajesh Sivasubramony,
Christopher Greene, Mark Poliks, and Peter Borgesen – Binghamton University; Luke
Wentlent and Michael Meilunas – Universal Instruments; Nancy Stoffel, David Shaddock
and Liang Yin – GE Global Research
Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS
Applications B. Lee, R. Katkar, G. Gao, G. Fountain, S. Lee, L. Wang, C. Mandalapu,
C. Uzoh and L. Mirkarimi – Xperi; B. Sykes and M. Litjens – Xyztec; Y. Niu, S. Shao,
J. Wang and S. Park – Binghamton University
Modeling and Design of 2.5D Package With Mitigated Warpage and Enhanced Thermo-Mechanical
Reliability Jing Wang, Yuling Niu, and Seungbae Park – Binghamton University; Alexander
Yatskov – Juniper Networks
The Experimental and Numerical Study of Electromigration in 2.5D Packages Jiefeng
Xu, Yuling Niu, Stephen R. Cain, and S.B. Park – Binghamton University; Scott McCann,
Hohyung Lee, and Gamal Refai-Ahmed – Xilinx, Inc
In addition to the papers, IEEC Director, SB Park served as Session Chair for the
Applied Reliability session, and IEEC Associate Director, Benson Chan served as Session
Chair for the Emerging Technologies Joint with Advanced Packaging session.
For more information about our research and center, please contact Benson Chan or SB Park.
