A message from the 2024 EPS Organizing Committee:
Our 35th annual Electronics Packaging Symposium will take place Sept. 4-5, 2024, at the Binghamton University Innovative Technologies Complex. We will focus on various aspects of electronic packaging and how advance packaging is evolving toward a Chiplet future. We will update this webpage with the session titles and keynote speakers. We look forward to seeing you in September.
Click here to download the 2024 program.
EXECUTIVE CHAIRS:
 |
Dr. Mukesh V. Khare Vice President, Semiconductor and AI Hardware IBM Research |
 |
Dr. Bahgat Sammakia Vice President for Research Binghamton University |
 |
Cliff Macklin Technology Director, Digital & Electrical Systems GE Research |
