Mr. Chan received his B.S. in Mechanical Engineering in 1981 and M.S. in Engineering Science in 1987 from Rensselaer Polytechnic Institute. Mr. Chan has Solid background in Electronic Packaging, with strong emphasis in High Speed Applications and Electrical Connector design. Mr. Chan had a diverse career with IBM for 22 years in the areas of Process Engineer, Design Engineer and Development Engineer. At IBM he was an Advisory Engineer in the Connector Development group responsible for developing custom connectors used in I, P and Z series mainframes for IBM. He was also the lead mechanical engineer for the development of the first 10Gbps x 12 optical transceiver in IBM. In the last 4 years at IBM, he was a taskforce lead managing members around the world responsible for correcting problems with LGA connectors for Z series systems as well as the 10K RPM hard drives for IBM. After IBM, he was with Endicott Interconnect Technologies for 12 years as a Chief Scientist. At EIT, he was the principle investigator for the DARPA Terabus III program, responsible for the design and build of a flexible optical waveguide capable of 25Gbps per channel with 48 channels interconnecting 2 hybrid optical modules. For a large DoD project, he provided all packaging options to dense pack the maximum number of processing elements into a given space, he also provided thermal solutions to support a 72KW cabinet. Mr. Chan holds 52 Patents in the fields of electronic packaging and advanced Connectors. He has 18 published papers in the fields of electronic packaging and connectors (ECTC, iMAPS, Photonics Journal, Fleck Research). Mr. Chan is also a director for iMAPS and the president of the Empire Chapter of iMAPS.
Benson Chan
Associate Director, S3IP
S3IP – Small Scale Systems Integration and Packaging; Research, Office of the Vice President for
Background
Education
