Integrated Electronics Engineering Center (IEEC)

 

OUR MISSION: ADVANCING FORWARD, TOGETHER.

With expertise in the electronics packaging research, the Integrated Electronics Engineering Center (IEEC) promotes economic development by acting as a conduit between the electronics industry and university resources. We promote analytical research on the challenges of current and emerging technology in the market, while providing students with real-life application of their engineering knowledge.

 

What we provide to Industry: 

  • Services: Consultations, analytical work, environmental stressing, modeling, reliability assessments and failure analysis, and materials evaluation.
  • Connection to university resources and faculty experts in their respective field.
  • Exclusive access to past, current and on-going research and reports.
  • Access to our cutting-edge laboratory equipment and tools

What we provide to Academia:

  • Opportunity for research funding, ADL grant program.
  • Support for development of new/innovative research proposals.
  • Networking opportunities with our industry partners and other resources at Binghamton University.
  • Access to our cutting-edge laboratory equipment and tools.
  • Collaboration with IEEC staff to solve YOUR research problems.

 We house industry research projects on topics such as:

  • Reliability analysis
  • Mechanical/thermal analysis and testing
  • Solder mechanics
  • Failure mechanism determination
  • Micromechanical analysis and testing
  • Sensor Packaging; Power Electronics
  • Industry 4.0 and Artificial Intelligence

 

Featuring:

 


SMART ELECTRONICS MANUFACTURING LAB (SEML)

SMART ELECTRONICS MANUFACTURING LAB (SEML)

In partnership with Koh Young Technologies, Inc., our Smart Electronics Manufacturing Lab is heading towards Industry 4.0

learn more

 


2019 ELECTRONICS PACKAGING SYMPOSIUM

2019 ELECTRONICS PACKAGING SYMPOSIUM

In partnership with GE, Our annual Electronics Packaging Symposium will take place this Fall!

learn more

 


 WE LOOK FORWARD TO PARTNERING WITH YOU!

 WE LOOK FORWARD TO PARTNERING WITH YOU!

 We solve problems through partnership. Learn more of who we are, what we do and what we can offer you! 

learn more

 

 Upcoming Events:

Call For Proposals

Pooled Research Projects for the year 2019-2020

Faculty members are encouraged to submit proposals for an opportunity to be "seed" funded by the IEEC, up to 50k, on collaborative projects with industry TAB members.

Please take a look at our guidelines for more information on the proposal, and visit our member portal for more information on our TAB members and their project needs.

Submission deadline: April 30, 2019

Please submit to: IEEC@binghamton.edu

Awarding of the 2019-2020 Pooled Research Projects: May 15, 2019

 

 

 

Award to be presented

IEEC to receive Outstanding Research Award, presented by Koh Young Technology, Inc.

Working together for nearly 3 years in SEML, Koh Young Technology Inc. has been a part of providing invaluable technical support with the smart factory, and together, our research has advanced in fine-tuning SMT to feature accuracy, reliability and process optimization.

Thank you Koh Young Technology Inc., for this recognition and your valued partnership.

 

News:

2019 Binghamton University Industry Day

2019ase

We would like to place a special thanks to ASE for graciously hosting our  successful "Binghamton University Industry Day." 

This event took place in San Jose, California, where our IEEC Director, SB Park and Associate director, Benson Chan, together with the S3IP team, provided companies on the west coast an opportunity to learn about the uniqueness of our centers and labs. 

Topics of interest were:

• Thermal management, failure analysis, reliability improvement, material properties and mechanics for electronics manufacturing, including heterogeneous integration

• Advances in Industry 4.0 automation for electronics manufacturing lines

• Progress in commercialization of flexible hybrid electronics

• Techniques for data center energy efficiency improvement

• Warpage Engineering and stress reduction for improved assembly and reliability

More information on this event to come.

 

 

Technical Advisory Board Meeting

tabmembers

Thank you to our Technical Advisory Board, faculty and staff members for attending our Technical Advisory Board Meeting held on March 12, 2019.

At this meeting, industry members shared their project needs, while faculty members shared their research topics. This opened the floor for potential collaboration on Pooled Research Projects for the year 2019-2020.

Faculty members are encouraged to submit proposals for an opportunity to be "seed" funded by the IEEC.

Deadline for submission of research proposals: April 30, 2019

Awarding of the 2019-2020 Pooled Research Projects: May 15, 2019

Please take a look at our guidelines.

Proposals may be submitted to IEEC@binghamton.edu.