IEEC

Integrated Electronics Engineering Center

The Integrated Electronics Engineering Center is committed to the advancement of electronic packaging technology and the electronics industry. Founded in 1991, this New York State Center for Advanced Technology conducts leading edge research in a wide variety of packaging areas that benefit technological advancements, and member companies.

IEEC Services

Failure Analysis

The Reliability and Failure Analysis Lab focuses on evaluating the reliability of electronic packaging, performing construction analysis, determination of failure modes of electronic devices and assemblies.

Failure Analysis

Modeling

Microelectronic systems have peculiar thermal distributions and are prone to a number of mechanical and thermomechanical stress failures.

Modeling

Consultation

Our staff is highly experienced in electronic packaging technology. We are happy to answer electronics related questions, with formality ranging from a phone call to a full report.

Consultation

Smart Electronics Manufacturing

Industry 4.0 describes smart, interconnected machine tools and a supply chain that improves the assembly processes for the electronic devices we use today.

Smart Electronics Manufacturing

Material Evaluation

Microelectronic systems have peculiar thermal distributions and are prone to a number of mechanical and thermomechanical stress failures. 

Material Evaluation

Environmental Stressing

All devices experience stresses resulting from their environment, which can change according to the application and state of operation.

Environmental Stressing