Our 35th Annual Electronics Packaging will be held in-person this year at Binghamton University ITC campus. Please check the main page for the speaker and session chair info.
Here are the confirmed speakers for our 35th Annual Electronics Packaging Symposium. This page will fill up with speakers and session chairs as they are confirmed.
Session Chairs and Speakers
Session 0: Keynote Speakers - (Benson Chan)
Speaker: Maryam Rahimi (Samsung)
Title: Advanced Packaging in the Era of HPC and AI
Speaker: Sireesha Gogineni (AMD)
Title: Advanced packaging : Making heterogeneous integration for AI a reality
Session 1: Future of Computing for HPC / AI – Sathya Raghavan & Aakrati Jain (IBM)
Speaker: Gi-Joon Nam (IBM)
Title: Infusing AI and ML into Chip Design on the Hybrid Cloud for Future SoC Development
Speaker: John Lau (Uni-micron)
Title: Co-Packaged Optics – 3D Heterogeneous Integration of Photonic IC and Electronic IC
Speaker: Nicole Saulnier (IBM)
Title: Inventing what’s next in AI Hardware
Session 2: Photonics Packaging – John Mazurowski (Penn State Optical Lab), Colin McDonough (AIM)
Speaker: Samuel Serna Otálvaro (Bridgwater State Univ)
Title: FUTUR-IC: A path toward building a sustainable optoelectronic microchip industry
Speaker: Kevin Chen (University of Pittsburgh)
Title: Femtosecond laser 3D inscription of Lightwave circuits for Optoelectronics Packaging
Speaker: Bart Bergman (Dream Photonics)
Title: Photonic Wirebonds for Photonic Integration
Session 3: Thermal Challenges – Ramchandra Kotecha (GE Aerospace)
Speaker: Girish A. Kini (AMD)
Title: Thermal landscape for Datacenter GPUs
Speaker: Srikanth Rangarajan (Binghamton)
Title: Thermal management of next generation of electronics packages: Single and Two phase cooling
Speaker: Peter Debock, Jungho Kim (ARPA-E)
Title: ARPA-E COOLERCHIPS technology for a future of energy efficient high power density / AI Data Centers
Session 4: Flexible, Wearable and Additive Electronics – Felippe Pavinatto (GE Aerospace). Mark Poliks (Binghamton)
Speaker: Urs Berger (XTPL)
Title: Ultra Precise Solder Paste Deposition for Advanced Electronics Packaging
Speaker: Christine Kallmayer (Fraunhofer IZM)
Title: Technologies and Materials for Flexible and Stretchable Sensors
Speaker: Chris Tabor (AFRL)
Title: Flexible and Stretchable Electronics with Printed Liquid Metals
Session 5: Heterogeneous Integration – Sathya Raghavan & Aakrati Jain (IBM)
Speaker: John Knickerbocker (IBM)
Title: Multi-chiplet heterogeneous Integration with advanced packaging technologies for next generation system applications
Speaker: Tiwei Wei (Purdue)
Title: Advanced Manufacturing for Semiconductor Packaging and Electronic Cooling
Speaker: Charles Woychik (nHanced Semiconductor)
Title: Heterogeneous Integration - The Future of Semiconductors
Session 6: Substrates, Platform for Advanced Packaging – Shelby Nelson (Mosaic)
Speaker: Meredith LaBeau (Calumet)
Title: Onshoring Organic Substrates, a tale of domestic manufacturing and DoD investments
Speaker: Venky Sundaram (3D System Scaling)
Title: Glass substrates: Past, Present and the Future
Speaker: Jobert Van Eisden (MKS Instruments)
Title: Advanced IC substrate metallization
Session 7: mmWave and 5G Packaging – Jason Case (GE Aerospace)
Speaker: Atom Wanatabe (IBM)
Title: Packaging Technology for Next Generation mmWave Commmunications: Scalable Heterogeneous AiP Modules and the Future Role of Chiplets
Speaker: Cheolbok Kim (Corning)
Title: Aerosol Jet Printed Frequency Selective Surface (FSS) for Antenna Gain Enhancement at D-band
Speaker: Shelby Nelson (Mosiac)
Title: Thin Glass Fabrication for Advanced Packaging Applications
Session 8: Power Electronics / Harsh Environments – David Shaddock (GE)
Speaker: Doug Hopkins (NC State)
Title: 3D Heterogeneous Power Integration Incorporating ANN ML and Genetic Algorithms for TSV/TGV Optimization
Speaker: Patrick McCluskey (Universtity of Maryland)
Title: AI-Based Reliability Assessment of Power Electronics for Photovoltaic Inverters
Speaker: Ramchandra Kotecha (GE Aerospace)
Title: Power Module Packaging using Direct Write Technology
