Our 35th Annual Electronics Packaging will be held in-person this year at Binghamton University ITC campus. Please check the main page for the speaker and session chair info.
Here are the confirmed speakers for our 35th Annual Electronics Packaging Symposium. This page will fill up with speakers and session chairs as they are confirmed.
Session Chairs and Speakers
Session 0: Keynote Speakers - (Benson Chan)
Speaker: Maryam Rahimi (Samsung)
Title: Advanced Packaging in the Era of HPC and AI
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Session 1: Future of Computing for HPC / AI – Sathya Raghavan & Aakrati Jain (IBM)
Speaker: Hoaoutar El Maghraoui (IBM)
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Session 2: Photonics Packaging – John Mazurowski (Penn State Optical Lab), , Colin McDonough (AIM)
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Session 3: Thermal Challenges – Ramchandra Kotecha (GE Aerospace)
Speaker: Girish A. Kini
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Speaker: Srikanth Rangarajan (Binghamton)
Title: Single and Two phase cooling of next generation of electronic systems
Speaker: Peter Debock (ARPA-E)
Title: ARPA-E COOLERCHIPS technology for a future of energy efficient high power density / AI Data Centers
Session 4: Flexible, Wearable and Additive Electronics – Felippe Pavinatto (GE Aerospace)
Speaker: Urs Berger (XTPL)
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Speaker: Christine Kallmayer (Fraunhofer IZM)
Title: Novel Materials and Technologies for Soft Robotic Grippers
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Session 5: Heterogeneous Integration – Sathya Raghavan & Aakrati Jain (IBM)
Speaker: John Kickerbocker (IBM)
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Speaker: Tiwei Wei (Purdue)
Title: Investigation of High Current Fine Grain Power Devices for 3D Heterogeneous Integration
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Session 6: Substrates, Platform for Advanced Packaging – Shelby Nelson (Mosaic)
Speaker: Meredith Le Beau (Calumet)
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Speaker: Venky Sundaram
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Session 7: mmWave and 5G Packaging – Jason Case (GE Aerospace)
Speaker: Atom Wanatabe (IBM)
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Speaker: Cheolbok Kim (Corning)
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Speaker: Shelby Nelson (Mosiac)
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Session 8: Power Electronics / Harsh Environments – David Shaddock (GE)
Speaker: Doug Hopkins (NC State)
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