Nanocomposite Pastes with Better Thermal and Mechanical Performance Howard Wang
High-Bi Alloys for a High-Temperature Pb-Free Solder Alternative Junghyun Cho
Reliability of a Nano-Cu Based Alternative to High-Temperature Solders Peter Borgesen
Glass Interposers: Superconformal Through Glass Via (TGV) Metallization, Circuitization
and Testing - Nikolay Dimitrov and Peter Borgesen
IEEC Packaging Materials Database - Wayne E. Jones Jr., Peter Borgesen, Junghyun Cho
Characterization and Control of the Microstructure of SnAgCu Solder Joints - Eric
J. Cotts
Copper and Copper-alloy Nanoparticle Inks for Electronics Printing - Chuan-Jian Zhong
Universal TGV reliability test vehicle using a glass interposer and glass chips -
S.B. Park
2012-13
Characterization and Control of the Microstructure of SnAgCu Solder Joints - Eric
Cotts
Correlating Chemical Composition and Electronic Structure with Optoelectronic Properties
of Thin Metal Oxides for Flexible Transparent Electronics, Louis Piper Glass Interposers
- Nik Dimitrov and Peter Borgesen
IEEC Packaging Materials Database - Wayne Jones
Microstructures and Properties of Very Small Solder Joints in TSV Scale Assemblies
- Peter Borgesen
Pb-Free Solders for High-Temperature Electronics - Junghyun Cho
Silver Nanopaste for Thermal, Electrical and Mechanical Bonding - Howard Wang
Through Glass Via (TSV) Interposer Reliability Testing 2nd Year Project with a Developed
Test Vehicle - SB Park
2011-12
Alloy Design and Developments for High-Temperature Solders - Junghyun Cho
Characterization and Control of the Microstructure of SnAgCu Solder Joints - Eric
Cotts
Glass Interposers - Nikolay Dimitrov & Peter Borgesen
IEEC Packaging Materials Database - Wayne Jones
A Quantitative Solder Joint Life Prediction Model - Mohammad Khasawneh & Peter Borgesen
Characterization of High Speed Joint-Level Test and Comparison with Board-Level Test
- James Pitarresi
A Wave Guiding Over Layer for Optical Interconnects with Integrated Source, Detector
and External Coupling - David Klotzkin
Universal TSV Reliability Test Vehicle Using a Glass Interposer and Glass Chips -
SB Park
New" Microstructures and Properties of Very Small Solder Joints in Assemblies Ranging
from TSV to LGA Based - Peter Borgesen
2010-11
Packaging Materials Design and Evaluation for High-Temperature Electronics - Junghyun
Cho
Separating In-Plane and Out-of-Plane Misalignment and Deformation Measurements by
Image-Shearing Holographic Interferometry - Vladimir V. Nikulin
IEEC Packaging Materials Database - Wayne E. Jones, Jr
Low-k Flip Chip Package Chip-Package Interaction - S.B. Park
Modeling Processing and Thermal Properties of Novel Materials for use in Electronics
Packaging Applications - Bruce T. Murray
Characterization of High Speed Joint-Level Test and Comparison with Board-Level Test
- James M. Pitarresi
Enhancement of the Performance of Thermal Interface Bondlines Materials and Processing
Improvement - Eric Cotts
Damage Mechanisms and Acceleration Factors for No-Pb TSOP and QFN Type Assemblies
in Thermal Cycling - Peter Borgesen
2009-10
The Reliability of Microbeams against Stiction and Collapse Failures Due to Capillary
and Electrostatic Forces - Mohammad I. Younis
Aligned Silver Nanowires for Thermal Interface Materials and Anisotropic Conducting
Films - Howard Wang
Micro-Impact Pendulum Fatigue Test: Development of a Replacement for High-Speed Strength
Testing - James M. Pitarresi
Characterization of CZT Crystal Strength and Measurement of Processing and Packaging
Stress for the micro Interconnect - S.B. Park
A Novel Holographic Interferometry Approach to Measuring In-Plane and Out-of-Plane
Misalignments and Deformations in Packaging Applications - Vladimir V. Nikulin
Better Acceleration Factors and More Highly Accelerated Testing of Lead Free Solder
Joints - Susan Lu
Prediction and Analysis of Thermal Cycling Results for Lead Free Soldered Products
- Mohammad T. Khasawneh
Sporadic Failures of Solder Joints on Electroplated Pad Finishes - Nikolay Dimitrov,
Eric Cotts
Study of the Effect of Sn Plating Parameters on: Sn film Stress, Sn film Microstructure
and Sn film propensity for forming Sn Whiskers - Eric Cotts, Nikolay Dimitrov
2008-09
A Comparative Study of Mechanical Testing Reliability Techniques for Pb-free Electronics
Assemblies - Dr. James Pitarresi, Dr. Daryl L. Santos
Multiscale Modeling and Experiments of Underfill Flow in Large Dies - Ying Sun, Timothy
Single
In-Situ Characterization of Nanostructured Thermal Interface Materials via Flash Diffusivity
Method and Infrared Microscopy - Ying Sun
High-k Ceramic Thin Films for Embedded Capacitors - Junghyun Cho
Investigation of Chip-Package Interaction - for Flip Chip Solder and low-k Layer -
S.B. Park
Computational Modeling and Experiments for Underfill Process Enhancement - Ying Sun,
Timothy Singler
Mechanical Shock and Vibration Performance of Packaging Interconnects: Modeling and
Measurement - James M. Pitarresi
The Effects of Sn Grain Size and Orientation, and Intermetallic Compound Formation,
on the Reliability of Pb-Free Solder Joints - E. Cotts; Physics and Materials Science
Design and fabrication of polymeric optical interconnects on flexible substrates -
Oana Malis
Understanding, Controlling and Improving Electrodeposition in the Microelectronics
Industry - Dr. Nikolay Dimitrov, Dr. Eric Cotts
Holographic Interferometry for Misalignment Measurements in Photonic Packaging Applications:
Practical Enhancements of the Approach - Dr. Vladimir V. Nikulin
