Research 2015-2016

  • Characterization of the Microstructure and Reliability of Si/micro Cu Pillar/Solder/Glass Assemblies
    E. Cotts, B. Arfaei
  • Nano-Cu Based Alternative to High-Temperature Solders
    P. Borgesen
  • New Constitutive Relations for Solder in Cycling
    C. Greene
  • Bismuth-based Solders and Transient Liquid Phase Bonds for High-Temperature Electronics
    J. Cho
  • Determining Factors Controlling Adhesion of Pulsed Laser Sintered and Nonoink Printed Traces on Flexible Substrates
    C-J Thong, B. Shim, M. Poliks
  • Enhance the Cu/EMC Interface Adhesion by Controlling Surface Finish of Cu
    P. Mu, G. Zhou
  • In-Situ Nano Scale Strain Measurement Using 2D DIC with SEM
    SB Park