Areas of Research Conducted by our Faculty
- Design and Manufacturing
- Dynamics and Mechatronics
- Materials
- Solid Mechanics and Mechanical Design
- Transport Phenomena and Energy
Research Facilities
- Acoustics Core
- Additive Manufacturing Laboratory
- Micro/Nano-Electro-Mechanical Systems
- Opto-Mechanics
- Transport Sciences Core
- Vibration Core
Snapshot of Current Funded Research
Design and Manufacturing
Changhong Ke
- Exploiting Nanoscale Interfaces to Enhance Bulk Mechanical Response of Additively Manufactured Boron Nitride Nanotube-Metal Composites – National Science Foundation
SB Park
- Development of Closed-Loop Control and Optimization Modules of the Printed Circuit Board Assembly Processes in Surface Mount Technology - Koh Young Technology Incorporated
Mir Jalil Razavi Aghjeh
- Mechanics of the Formation of Cortial Folding Patterns in the Developing Human Brain - National Science Foundation
Bahgat Sammakia (PI), Scott Schiffres, SB Park (co-PI’s)
- Radiation-Hard Microelectronics Workforce Development Consortium – Purdue University
Scott Schiffres (PI), Bahgat Sammakia, Changhong Ke (co-PI’s)
- PFI-TTT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices – National Science Foundation
Pu Zhang
- Polymer-Based Conformal Space Radiation Shield with Thermal Management Manufactured by Five-Axis 3D Printing Platform - Advanced Cooling Technologies
Dynamics and Mechatronics
Ronald Miles (PI), Changhong Ke (Co-PI)
- Capacitive Pressure/ Velocity Probe for Acoustic Measurements in the Human Ear Canal - National Inst on Deafness & Other Comm Disorders
Sherry Towfighian (PI)
- MEMS High Voltage Triboelectric Levitation: A Generactuator - National Science Foundation
- Self-Powered Load Sensors for Total Knee Replacement Health Monitoring - The National Institute of Arthritis and Musculoskeletal and Skin Diseases
Kaiyan Yu (PI)
- CAREER: Simultaneous and Independent Control of Nanostructured Objects Through the Use of Coupled External Electric Fields - National Science Foundation
Materials
Jennifer Iacabucci (PI), Junghyun Cho (Co-PI), SB Park (Co-PI)
- Artificial Intelligence Collaborative Research Alliance - IBM
Jingzhou (Frank) Zhao
- Thermal Drawing of Composite Fibers for Wearable Energy Textiles - National Science Foundation
Guangwen Zhou
- Collaborative Research: Coordinated In-Situ Dynamic Experiments and Atomistic Modeling of Surface Segregation in Alloys- National Science Foundation
- In Situ Visualization and Theoretical Modeling of Early Stages of Oxidation of Metals and Alloys - US Department of Energy
Solid Mechanics and Mechanical Design
Changhong Ke
- EAGER: Active Self-Strengthening and Reinforcement of Additively Manufactured Metal Nanocomposites in a Corrosive Environment - National Science Foundation
SB Park
- Investigation of Warpage for 2.5D and Heterogeneously Integrated Package and Its Assemblies - Google LLC
Mir Jalil Razavi
- CDS&E/Collaborative Research: Physics-Informed Machine Learning for Tailoring the Multidirectional Mechanical Properties of Composite Materials - National Science Foundation
Pu Zhang
- CAREER: Electro-Mechanical Behaviors of Soft Conductive Composites Embedded with Liquid Metal Fiber Networks - National Science Foundation
Transport Phenomena and Energy
Paul Chiarot
- Conformal Polymeric Thin Films Manufactoring Using Electrospray Printing - Purdue University - SRC CHIRP
Bahgat Sammakia
- SCALE: A Microelectronic Workforce Development Production Project - Purdue
Bahgat Sammakia (PI), Scott Schiffres, SB Park (co-PI’s)
- Radiation-Hard Microelectronics Workforce Development Consortium Subagreement No. 13000844-021 – Purdue University
Scott Schiffres
- I-Corps: Additive Laser Metal Deposition onto Sillicon for Enhanced Electronics Cooling – National Science Foundation
- Intermetallic Interfacial Thermal Transport for Advanced Electronics Manufacturing - National Science Foundation CAREER
Scott Schiffres (PI), Bahgat Sammakia, Changhong Ke (co-PI’s)
- PFI-TTT: Enhanced Electronic Cooling via 3D Printing from Additive Laser Fabrication of Heat Removal Devices – National Science Foundation
Xin Yong (PI), Paul Chiarot, Peter Huang (Co-PI's)
- Capillary-Assisted Printing of Structured Colloidal Monolayers - National Science Foundation
Related Research Centers
- The Small Scale Systems Integration and Packaging (S3IP) Center
- Integrated Electronics Engineering Center (IEEC)
- Center for Advanced Microelectronics Manufacturing (CAMM)
- Center for Autonomous Solar Power (CASP)
- Center for Research in Advanced Sensor Technologies and Environmental Sustainability (CREATES)